Double tilt 4 Electrodes Transfer Holder
Vacuum transfering function
4 Electorodes
Heating chip +1100℃ and Biasing chip
High resolution performance up to +800℃ *Sample:Ag
Line UP MEMS Chip
Spec. of Heating Chip 1100℃
High performance Heating MEMS chips,
- Temperature control range : +30℃ to 1100℃
- Resolution : Less than 0.14 nm (at +800℃)
- Rate : Heating & Cooling rate in < 1 Sec.
Collaborative development with NORCADA
Spec. of low noise FIB Biasing Chip
High Resistivity biasing MEMS chips
Semiconductor-grade Noise Reduction Dielectrics
Sample Gap
- Two chip configurations
- Gap on Membrane allow more precise
- Size:10 μmx100 μm
Electrode
- 2 Probe and 4 Probe Layout
- 10 μm Electrode Gap
- Platinum Standard Electrode Material
Electrode on Gap series
Mel-Build’s solution chip Strong points
- The gap width is narrowed by sandwiching the insulating film.
- Superior measurement quality and SNR, in both AC and DC modes
- Less noise than general chips.
Main components
TEM holder Specification
Component | Vacuum Transfer / Double tilt / Biasing |
Electrode | 4 Electrodes |
Temp.range | +30℃~+1100℃ |
Resolution | Less than 0.24nm (Guarantee spec.) |
tilt(JEOL) | X = ± 15 degree , Y=± 12 degree @ HR PP |
tilt(TFS) | X = ± 20 degree , Y=± 15 degree @ ST PP |
Sample set | Smart Set System |
TEM | JEOL PP type HR/FHP and Thermofisher |
Include item | Y tilt controller, Biasing controller, Software,Safety Operation Stand, and holder introduce. |
*NOTE | MEMS chip price is quoted on a case-by-case basis. (Not included MEMS chip cost) |