Double tilt 4 Electrodes Transfer Holder
Vacuum transfering function
4 Electorodes
Heating chip +1100℃ and Biasing chip
High resolution performance up to +800℃ *Sample : Ag
Line UP MEMS Chip
Spec. of Heating Chip 1100℃
High performance Heating MEMS chips,
・Temperature control range : +30℃ to 1100℃
・Resolution : Less than 0.14 nm (at +800℃)
・Rate : Heating & Cooling rate in < 1 Sec.
Collaborative development with NORCADA
Spec. of low noise FIB Biasing Chip
High Resistivity biasing MEMS chips
Semiconductor-grade Noise Reduction Dielectrics
Sample Gap
・Two chip configurations
・Gap on Membrane allow more precise
・Size: 10 μmx100 μm
Electrode
・2 Probe and 4 Probe Layout
・10 μm Electrode Gap
・Platinum Standard Electrode Material
Electrode on Gap series
Mel-Build’s solution chip Strong points
・The gap width is narrowed by sandwiching the insulating film.
・Superior measurement quality and SNR, in both AC and DC modes
・Less noise than general chips.
Main components
TEM holder Specification
| Component | : Vacuum Transfer / Double tilt / Biasing |
|---|---|
| Electrode | : 4 Electrodes |
| Temp.range | : +30℃～＋1100℃ |
| Resolution | : Less than 0.24nm (Guarantee spec.) |
| tilt(JEOL) | : X = ± 15 degree , Y=± 12 degree @ HR PP |
| tilt(TFS) | : X = ± 20 degree , Y=± 15 degree @ ST PP |
| Sample set | : Smart Set System | TEM | : JEOL PP type HR/FHP and Thermofisher |
| Include item | : Y tilt controller, Biasing controller, Software,Safety Operation Stand, and holder introduce. |
| *NOTE | : MEMS chip price is quoted on a case-by-case basis. (Not included MEMS chip cost) |
Safety Operation Stand of tem holder introduce
